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busbar
Different length, width, and thickness correspond to different server architectures; the connection method depends on the PSU (power supply).
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Extruded Aluminum Busbar
There are two extrusion processes for aluminum busbars: 1. Extruded mica-reinforced aluminum busbar (Alloy 1xxx) and 2. Extruded aluminum busbar with nickel welding (Alloy 6xxx).
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Snap-on Liquid Cooling Heat Sink Base
Application: Liquid cooling for server CPUs and industrial control equipment.
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Multi-Module Heat Pipe Radiator
Applications: Suitable for multi-heat-source scenarios such as multi-chip servers and power semiconductor modules.
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Liquid-Cooled Copper-Aluminum Composite Radiator
Applications: Used in data center liquid-cooling systems and thermal management for new-energy vehicle battery packs.
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Water-cooled shunt
Application: Distributes coolant in multi-device liquid-cooling systems, such as mining rigs and server clusters.
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Water-cooled heat sink
Applications: Commonly used in liquid-cooling thermal management systems for servers, high-end graphics cards, CPUs, and IGBT power modules.
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Stamped hard/aluminum busbars, flexible copper busbars
Precision machining using die-stamping processes
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Vapor Chamber Fin Radiator
Application: Specifically designed for high-performance laptops to dissipate heat from the CPU and GPU.
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Separate Heat Pipe Radiator
Applications: Commonly used in space-constrained devices such as laptops and all-in-one PCs, or in scenarios requiring long-distance heat dissipation.
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Annular Heat Spreader Radiator
Applications: Primarily used for heat dissipation of circular heat sources in high-power LED lighting, laser equipment, and other similar applications.
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High-Density Fin Heat Pipe Radiator
Applications: Suitable for high-power server CPUs, RF modules in communication base stations, and other similar applications.
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YD-UQDB Series Blind-Mate Fluid Connectors
The YD-UQDB series quick-connect fittings are designed for data center cooling applications and comply with the OCP standard, making them well-suited to meet the high-flow, low-pressure-drop requirements of data center cooling systems.
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YD-UQD Series Direct-Acting Fluid Connectors
The YD-UQD series quick-connect couplings are designed for data center cooling applications and comply with the OCP standard, making them well-suited to meet the high-flow, low-pressure-drop requirements of data center cooling systems.
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YDMC/YDMO Series Connectors
Precision structure, suitable for guidance systems with misalignment errors of less than 1.5 mm.
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YDLQ Series Connectors
Cooling and Temperature Regulation A Combination of Performance and Safety
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BC Series Power Take-Off Units
Conductor material: 1070 high-conductivity aluminum busbar / T2 red copper busbar; insulating enclosure: flame-retardant engineering plastic (UL94 V-0 rating).
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