busbar
Different length, width, and thickness correspond to different server architectures; the connection method depends on the PSU (power supply).
Learn more
Extruded Aluminum Busbar
There are two extrusion processes for aluminum busbars: 1. Extruded mica-reinforced aluminum busbar (Alloy 1xxx) and 2. Extruded aluminum busbar with nickel welding (Alloy 6xxx).
Learn more
Snap-on Liquid Cooling Heat Sink Base
Application: Liquid cooling for server CPUs and industrial control equipment.
Learn more
Multi-Module Heat Pipe Radiator
Applications: Suitable for multi-heat-source scenarios such as multi-chip servers and power semiconductor modules.
Learn more
Liquid-Cooled Copper-Aluminum Composite Radiator
Applications: Used in data center liquid-cooling systems and thermal management for new-energy vehicle battery packs.
Learn more
Water-cooled shunt
Application: Distributes coolant in multi-device liquid-cooling systems, such as mining rigs and server clusters.
Learn more
Water-cooled heat sink
Applications: Commonly used in liquid-cooling thermal management systems for servers, high-end graphics cards, CPUs, and IGBT power modules.
Learn more
Stamped hard/aluminum busbars, flexible copper busbars
Precision machining using die-stamping processes
Learn more
Vapor Chamber Fin Radiator
Application: Specifically designed for high-performance laptops to dissipate heat from the CPU and GPU.
Learn more
Separate Heat Pipe Radiator
Applications: Commonly used in space-constrained devices such as laptops and all-in-one PCs, or in scenarios requiring long-distance heat dissipation.
Learn more
Annular Heat Spreader Radiator
Applications: Primarily used for heat dissipation of circular heat sources in high-power LED lighting, laser equipment, and other similar applications.
Learn more
Contact Us
Email:
Address:
No. 99, Jinlong Avenue, Xiaojinkou, Huicheng District, Huizhou City, Guangdong Province, China
Online Consultation
Fill in the form below
Copyright © 2025 Huizhou TTC New Energy Technology Co., Ltd.