Snap-on Liquid Cooling Heat Sink Base

Application: Liquid cooling for server CPUs and industrial control equipment.
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Multi-Module Heat Pipe Radiator

Applications: Suitable for multi-heat-source scenarios such as multi-chip servers and power semiconductor modules.
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Liquid-Cooled Copper-Aluminum Composite Radiator

Applications: Used in data center liquid-cooling systems and thermal management for new-energy vehicle battery packs.
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Water-cooled shunt

Application: Distributes coolant in multi-device liquid-cooling systems, such as mining rigs and server clusters.
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Water-cooled heat sink

Applications: Commonly used in liquid-cooling thermal management systems for servers, high-end graphics cards, CPUs, and IGBT power modules.
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