Snap-on Liquid Cooling Heat Sink Base
Application: Liquid cooling for server CPUs and industrial control equipment.
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Multi-Module Heat Pipe Radiator
Applications: Suitable for multi-heat-source scenarios such as multi-chip servers and power semiconductor modules.
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Liquid-Cooled Copper-Aluminum Composite Radiator
Applications: Used in data center liquid-cooling systems and thermal management for new-energy vehicle battery packs.
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Water-cooled shunt
Application: Distributes coolant in multi-device liquid-cooling systems, such as mining rigs and server clusters.
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Water-cooled heat sink
Applications: Commonly used in liquid-cooling thermal management systems for servers, high-end graphics cards, CPUs, and IGBT power modules.
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Vapor Chamber Fin Radiator
Application: Specifically designed for high-performance laptops to dissipate heat from the CPU and GPU.
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Separate Heat Pipe Radiator
Applications: Commonly used in space-constrained devices such as laptops and all-in-one PCs, or in scenarios requiring long-distance heat dissipation.
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Annular Heat Spreader Radiator
Applications: Primarily used for heat dissipation of circular heat sources in high-power LED lighting, laser equipment, and other similar applications.
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High-Density Fin Heat Pipe Radiator
Applications: Suitable for high-power server CPUs, RF modules in communication base stations, and other similar applications.
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